V Ramgopal Rao
Poster-Accepted Abstracts: J Nanomed Nanotechnol
Conventional device technologies usually employ top-down fabrication methodologies for high volume manufacturing. However, as we enter the nano-scale regime and the Internet of Things (IoT) era, there are many challenges faced by the conventional top down approaches owing to the variability&reliability issues. Some of these issues with respect to the conventional technologies can be better addressed by employing a host of bottom up approaches through innovative process integration strategies. Further, there is also a need for an intelligent integration of diverse technologies, materials and processes on the same die or in a package for realization of future smart systems for the IoT Era. This talk will present some of these integration methodologies where completely diverse platforms, materials and approaches are brought together in order to realize a targeted system functionality useful for the IoT applications.