S Aravamudhan, K Kosaraju, K Garde and S Crawford
Accepted Abstracts: J Nanomed Nanotechnol
Engineered Nanomaterials (ENs) such as silica, ceria and alumina NPs are widely used in Chemical Mechanical Planarization (CMP) processes. However, the toxicity and cellular uptake of these NPs, which are strongly dependent on their physiochemical properties and their interaction with cells, are largely unknown. The objective of this work is to study and quantify the cellular uptake of colloidal silica NP slurries before and after CMP processing of GaAs substrates. Although it would seem that ENs can be taken up by cells, the evidence is disparate and the mechanism of uptake is either unclear or in their infancy. This is because of lack of accurate data on the physicochemical properties such as size, surface area, distribution, composition, purity, crystallinity, solubility, and aggregation and surface structure. First, a comprehensive physical and chemical characterization of the pre and post-CMP slurries are carried out using DLS, zeta potential, BET, XRD, FTIR, Raman, SEM and TEM. Next, GaAs substrates are polished with colloidal Silica NP slurries at standard conditions for 1-10 minutes on an IPEC Westech Avanti 472 CMP polisher. This is followed by post-CMP cleaning to remove used slurry material. Finally, cell exposure studies are carried out with A549 lung epithetical cell lines for 6-48 hours by comparing the cell viability of new and used slurries. The cellular uptake studies involves immunofluorescence staining of exposed cells, ultrastructural characterization (using TEM), Electrochemical Cell-substrate Impedance Sensing (ECIS) and bioanalytical analysis of digested cells (using ICP-OES).
S Aravamudhan is currently an Assistant Professor of Nanoengineering at the Joint School of Nanoscience and Nanoengineering, North Carolina A&T State University. He completed his PhD in Electrical Engineering from University of South Florida and postdoctoral research at Georgia Institute of Technology in Nanotechnology and Biomedical Engineering.