Journal of Nanomedicine & Nanotechnology

Cu₂O thin films by spray pyrolysis: A versatile alternative

7^th International Conference on MATERIALS SCIENCE AND NANOTECHNOLOGY

December 05-06, 2022 | Dubai, UAE

Mireny Ugalde Reygadas and Rebeca Castanedo Perez

National Polytechnique Institute Queretaro Unit, Mexico

Posters & Accepted Abstracts: J Nanomed Nanotechnol

Abstract:

Copper (I) oxide, Cu₂O, has been extensively studied due to its unique properties that allow it to be a prime candidate in a variety of applications ranging from solar cells to organic compound sensors. In the case of thin Cu₂O films, the pyrolysis spray (SP) has advantages over other conventional techniques, such as lower deposition time and temperature (Td), and greater covered area. Being a solution-based technique, it is possible to modify the chemical composition of the precursor solution to tune the properties of deposited films. The present work proposes the implementation of two reducing agents different from the conventional one (D-glucose). Thus, by means of home-made SP equipment, thin Cu₂O films were obtained using both reducing agents: di-ethanolamine (DEA) and L-ascorbic acid (AA), in the precursor solutions. Cu₂O films were obtained with the DEA solution at deposition temperatures, 280 ° C ≤ Td ≤ 320 ° C. Also, Cu₂O films were obtained from the AA solution at 280 ° C≤ Td ≤ 300 ° C. The minimum resistivity value was presented by the Cu₂O films deposited with AA solution; this value is like that obtained using glucose. However, the Td of Cu₂O films obtained with AA is lower, corresponding to a substrate temperature, 230 ° C ≤ Ts ≤ 250 ° C. This represents an advantage for the implementation of these films on flexible substrates. The analysis by UV-Vis in absorbance mode suggests the interaction of both reducing agents with the copper salt in the solution while the D-glucose did not show any optical difference. This allows us to suggest that reducing agents, when oxidized in solution, reduce the deposition temperature used to obtain Cu₂O . However, thermal decomposition of such reducing agents must be considered too, to avoid high resistivity films.